Tempus AI Multi-year precision-oncology platform partnership, ongoing
Multi-year partnership with Tempus AI spanning three workstreams: structured electronic integration of genomic results into clinical workflows, digital pathology, and multi-omic discovery infrastructure.
Vanderbilt's research collaboration with Tempus AI spans three workstreams: structured electronic integration of genomic results into Vanderbilt's clinical workflows, digital pathology, and multi-omic discovery infrastructure. The reference-laboratory integration was profiled by VUMC News in November 2024 as part of a broader effort to make reference-laboratory data first-class within the electronic health record - the same body of work that put Vanderbilt's structured-genomic-data EHR ahead of any other U.S. institution (see clinical genomics in the EHR).
Named programs
- Structured electronic integration of genomic reference-lab results into Vanderbilt's EHR
- Digital pathology collaboration
- Multi-omic discovery infrastructure
Selected talks (1)
- 25. Tempus Webinar (Virtual): "Integrating Structured Genomic Data in Clinic". May 12, 2022
Disclosures
This collaboration is publicly disclosed through two independent records: ASCO COI and CMS Open Payments.
Related: all collaborations · GE HealthCare · Epic · Microsoft · nference · NCCN · clinical genomics ehr · precision oncology.
Frequently asked questions
- What does the Tempus AI partnership cover?
- Vanderbilt's research collaboration with Tempus AI spans three workstreams: structured electronic integration of genomic results into Vanderbilt's clinical workflows, digital pathology, and multi-omic discovery infrastructure.
- How does the reference-laboratory integration work fit Vanderbilt's broader agenda?
- The reference-laboratory integration, profiled by VUMC News in November 2024, is part of a broader effort to make reference-laboratory data first-class within the electronic health record. It is part of the same body of work behind Vanderbilt's lead in structured genomic data in the EHR.